Open Access

ARTICLE

An Effective Thermal-mechanical Modeling Methodology for Large-scale Area Array Typed Packages

H. C. Cheng¹, C. Y. Yu², W. H. Chen³

1 Associate Professor, Department of Aerospace and Systems Engineering, Feng Chia University, Taichung, Taiwan 407, R.O.C., hccheng@fcu.edu.tw
2 Graduate Student, Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan 300, R.O.C.
3 Professor, Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan 300, R.O.C., whchen@pme.nthu.edu.tw