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Nucleation and Propagation of Deformation Twin in Polysynthetically Twinned TiAl

L. G. Zhou1, L. M. Hsiung2, Hanchen Huang1

Department of Mechanical, Aerospace & Nuclear Engineering, Rensselaer Polytechnic Institute, Troy, NY 12180, USA
Lawrence Livermore National Laboratory, Chemistry and Materials Science Directorate, P.O. Box 808, L-352, Livermore, CA 94551, USA

Computer Modeling in Engineering & Sciences 2004, 6(3), 245-252. https://doi.org/10.3970/cmes.2004.006.245

Abstract

Using molecular dynamics simulations, we study the deformation of polysynthetically twinned (PST) TiAl at room temperature. The simulation cell is pre-strained and thermodynamically relaxed to zero stress, so that no dislocations pre-exist in γ−α2 interfaces. A uniaxial compression is then applied along one 1/6<112] direction. Our results show that interfacial dislocation pairs nucleate at the γ−α2 interface under the compression. The glide and agglomeration of these dislocations lead to the nucleation of deformation twins from the interface. Based on our studies, twins may nucleate without pre-existing interfacial dislocations. Further we have monitored the propagation of the deformation twin, specifically its interaction with γ−γ and γ−α2 interfaces. The observations show that γ−α2 interfaces are stronger obstacles to the twin propagation than γ−γ interfaces are.

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APA Style
Zhou, L.G., Hsiung, L.M., Huang, H. (2004). Nucleation and propagation of deformation twin in polysynthetically twinned tial. Computer Modeling in Engineering & Sciences, 6(3), 245-252. https://doi.org/10.3970/cmes.2004.006.245
Vancouver Style
Zhou LG, Hsiung LM, Huang H. Nucleation and propagation of deformation twin in polysynthetically twinned tial. Comput Model Eng Sci. 2004;6(3):245-252 https://doi.org/10.3970/cmes.2004.006.245
IEEE Style
L.G. Zhou, L.M. Hsiung, and H. Huang, “Nucleation and Propagation of Deformation Twin in Polysynthetically Twinned TiAl,” Comput. Model. Eng. Sci., vol. 6, no. 3, pp. 245-252, 2004. https://doi.org/10.3970/cmes.2004.006.245



cc Copyright © 2004 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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