Table of Content

Open Access iconOpen Access

ARTICLE

A Three Dimensional Numerical Investigation of the T* integral along a Curved Crack Front

J. H. Jackson1, A. S. Kobayashi2, S. N. Atluri3

5353 Memorial Drive 1037, Houston, TX, 77007
University of Washington, Department of Mechanical Engineerng, Seattle, WA 98195-2600
University of California, Irvine, Aerospace Engineering, 5252 California Ave. Ste 140, Irvine, CA 92612

Computer Modeling in Engineering & Sciences 2004, 6(1), 17-30. https://doi.org/10.3970/cmes.2004.006.017

Abstract

The Tε*  integral was calculated numerically along an extending, tunneling crack front in an 8 mm thick, aluminum three-point bend (3PB) specimen, using a numerical model driven by experimentally obtained surface displacements. The model provided input to a contour integration for the Tε*  integral, via the Equivalent Domain Integral (EDI) method with incremental plasticity. Validity of the analysis was ensured by the agreement of the Tε*  integral obtained on the surface (plane stress) and the plane stress values from previous studies. Tε*   was observed to decrease from the outer surface of the specimen to the more constrained mid-plane. This difference became more pronounced as the crack grew.

Keywords


Cite This Article

APA Style
Jackson, J.H., Kobayashi, A.S., Atluri, S.N. (2004). A three dimensional numerical investigation of the T* integral along a curved crack front. Computer Modeling in Engineering & Sciences, 6(1), 17-30. https://doi.org/10.3970/cmes.2004.006.017
Vancouver Style
Jackson JH, Kobayashi AS, Atluri SN. A three dimensional numerical investigation of the T* integral along a curved crack front. Comput Model Eng Sci. 2004;6(1):17-30 https://doi.org/10.3970/cmes.2004.006.017
IEEE Style
J.H. Jackson, A.S. Kobayashi, and S.N. Atluri, “A Three Dimensional Numerical Investigation of the T* integral along a Curved Crack Front,” Comput. Model. Eng. Sci., vol. 6, no. 1, pp. 17-30, 2004. https://doi.org/10.3970/cmes.2004.006.017



cc Copyright © 2004 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
  • 1208

    View

  • 879

    Download

  • 0

    Like

Share Link