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Explicit Solutions of Stresses for a Three-Phase Elliptic Inclusion Problem Subject to a Remote Uniform Load

Ching Kong Chao1,2, Chin Kun Chen3, Fu Mo Chen4

Department of Mechanical Engineering, National Taiwan University of Science and Technology, Taiwan
Corresponding author, E-mail: ckchao@mail.ntust.edu.tw
Institute of Nuclear Energy Research, Atomic Energy Council, R.O.C.
Department of Mechanical Engineering, Nan-Kai University of Technology, Taiwan.

Computer Modeling in Engineering & Sciences 2010, 69(2), 119-142. https://doi.org/10.3970/cmes.2010.069.119

Abstract

A general solution to a three-phase elliptic inclusion problem subjected to a remote uniform load is provided in this paper. Analysis of the present elasticity problem is rather tedious due to the presence of material inhomogeneities and complex geometric configurations. Based on the technique of conformal mapping and the method of analytical continuation in conjunction with the alternating technique, the general expressions of the displacement and stresses in each layer medium are derived explicitly in a series form. The effects of the material combinations and geometric configurations on the interfacial stresses are discussed in detail and shown in graphic form.

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APA Style
Chao, C.K., Chen, C.K., Chen, F.M. (2010). Explicit solutions of stresses for a three-phase elliptic inclusion problem subject to a remote uniform load. Computer Modeling in Engineering & Sciences, 69(2), 119-142. https://doi.org/10.3970/cmes.2010.069.119
Vancouver Style
Chao CK, Chen CK, Chen FM. Explicit solutions of stresses for a three-phase elliptic inclusion problem subject to a remote uniform load. Comput Model Eng Sci. 2010;69(2):119-142 https://doi.org/10.3970/cmes.2010.069.119
IEEE Style
C.K. Chao, C.K. Chen, and F.M. Chen, “Explicit Solutions of Stresses for a Three-Phase Elliptic Inclusion Problem Subject to a Remote Uniform Load,” Comput. Model. Eng. Sci., vol. 69, no. 2, pp. 119-142, 2010. https://doi.org/10.3970/cmes.2010.069.119



cc Copyright © 2010 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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