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Dynamic Stress around Two Cylindrical Inclusions in Functionally Graded Materials under Non-Homogeneous Shear Waves

Xue-Qian Fang1, Jin-Xi Liu1, Ming-Zhang Chen1, Li-Yong Fu1

Department of Engineering Mechanics, Shijiazhuang Tiedao University, Shijiazhuang 050043, P.R. China

Computer Modeling in Engineering & Sciences 2010, 66(2), 101-116. https://doi.org/10.3970/cmes.2010.066.101

Abstract

In the authors' previous work (Zhang et al., 2010), the dynamic stress resulting from two cavities in exponential functional graded materials subjected to non-homogeneous shear waves has been studied. In this paper, the wave function expansion method is further developed to the case of two cylindrical inclusions embedded in functional graded materials, and the incident angle is also considered. The multiple scattering and refraction of non-homogeneous shear waves around the two inclusions are described accurately. The dynamic stress concentration factors around the two inclusions are presented analytically and numerically. The multiple effects of geometrical and physical parameters on the dynamic stress in functional graded materials are analyzed. These results can provide important reference in predicting the dynamic response of functional graded materials.

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APA Style
Fang, X., Liu, J., Chen, M., Fu, L. (2010). Dynamic stress around two cylindrical inclusions in functionally graded materials under non-homogeneous shear waves. Computer Modeling in Engineering & Sciences, 66(2), 101-116. https://doi.org/10.3970/cmes.2010.066.101
Vancouver Style
Fang X, Liu J, Chen M, Fu L. Dynamic stress around two cylindrical inclusions in functionally graded materials under non-homogeneous shear waves. Comput Model Eng Sci. 2010;66(2):101-116 https://doi.org/10.3970/cmes.2010.066.101
IEEE Style
X. Fang, J. Liu, M. Chen, and L. Fu, “Dynamic Stress around Two Cylindrical Inclusions in Functionally Graded Materials under Non-Homogeneous Shear Waves,” Comput. Model. Eng. Sci., vol. 66, no. 2, pp. 101-116, 2010. https://doi.org/10.3970/cmes.2010.066.101



cc Copyright © 2010 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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