Open Access

ARTICLE

The MLPG for Bending of Electroelastic Plates

J. Sladek¹, V. Sladek¹, P. Stanak¹, E. Pan²

1 Institute of Construction and Architecture, Slovak Academy of Sciences, 84503 Bratislava, Slovakia
2 Computer Modeling and Simulation Group, Department of Civil Engineering, University of Akron, Akron, OH 44325-3905, USA