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The MLPG for Bending of Electroelastic Plates

J. Sladek1, V. Sladek1, P. Stanak1, E. Pan2

Institute of Construction and Architecture, Slovak Academy of Sciences, 84503 Bratislava, Slovakia
Computer Modeling and Simulation Group, Department of Civil Engineering, University of Akron, Akron, OH 44325-3905, USA

TSP_CMES_267.pdf

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