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Interfacial Stresses Induced by a Point Heat Source in an Isotropic Plate with a Reinforced Elliptical Hole

Ching Kong Chao1,2, Chin Kun Chen1, Fu Mo Chen3

Department of Mechanical Engineering, National Taiwan University of Science and Technology, Taiwan
Corresponding author, E-mail: ckchao@mail.ntust.edu.tw
Department of Mechanical Engineering, Nan-Kai University of Technology, Taiwan.

Computer Modeling in Engineering & Sciences 2010, 63(1), 1-28. https://doi.org/10.3970/cmes.2010.063.001

Abstract

A general analytical solution for a reinforced elliptical hole embedded in an infinite matrix subjected to a point heat source is provided in this paper. Based on the technique of conformal mapping and the method of analytical continuation in conjunction with the alternating technique, the general expressions of the temperature and stresses in the reinforcement layer and the matrix are derived explicitly in a series form. Some numerical results are provided to investigate the effects of the material combinations and geometric configurations on the interfacial stresses. The solution obtained can be treated as Green's functions which enable us to formulate an integral equation for a reinforced elliptical hole embedded in an infinite matrix with a crack.

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APA Style
Chao, C.K., Chen, C.K., Chen, F.M. (2010). Interfacial stresses induced by a point heat source in an isotropic plate with a reinforced elliptical hole. Computer Modeling in Engineering & Sciences, 63(1), 1-28. https://doi.org/10.3970/cmes.2010.063.001
Vancouver Style
Chao CK, Chen CK, Chen FM. Interfacial stresses induced by a point heat source in an isotropic plate with a reinforced elliptical hole. Comput Model Eng Sci. 2010;63(1):1-28 https://doi.org/10.3970/cmes.2010.063.001
IEEE Style
C.K. Chao, C.K. Chen, and F.M. Chen, “Interfacial Stresses Induced by a Point Heat Source in an Isotropic Plate with a Reinforced Elliptical Hole,” Comput. Model. Eng. Sci., vol. 63, no. 1, pp. 1-28, 2010. https://doi.org/10.3970/cmes.2010.063.001



cc Copyright © 2010 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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