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Concurrent Atomistic/Continuum Simulation of Thermo-Mechanical Coupling Phenomena

Xianqiao Wang1, James D. Lee1

George Washington University, Washington, DC 20052. xqwang@gwmail.gwu.edu, jdlee@gwu.edu

Computer Modeling in Engineering & Sciences 2010, 62(2), 150-170. https://doi.org/10.3970/cmes.2010.062.150

Abstract

The concurrent methods for coupling molecular dynamics with continuum thermodynamics offer a myriad of challenging problems, mostly related with energy transmission, wave reflection, and damage propagation at the interfaces between the continuum description and the discrete description. In this work, by virtue of the atomistic field theory (AFT), we present an analysis to reconcile the compatibility between atomic region and continuum region and to calculate the matching temperature field of a heat conduction problem in a concurrent atomistic/continuum system. First, formulation of AFT with finite temperature and its corresponding finite element implementation are briefly introduced. Then we develop a new explicit algorithm with multiple-time-scale procedure to treat interfaces between atomic and continuum regions. Finally, AFT with this special algorithm is employed to investigate a thermal-mechanical coupling problem. This work provides a more fundamental understanding of thermomechanical phenomena at the interface between atomic and continuum regions.

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APA Style
Wang, X., Lee, J.D. (2010). Concurrent atomistic/continuum simulation of thermo-mechanical coupling phenomena. Computer Modeling in Engineering & Sciences, 62(2), 150-170. https://doi.org/10.3970/cmes.2010.062.150
Vancouver Style
Wang X, Lee JD. Concurrent atomistic/continuum simulation of thermo-mechanical coupling phenomena. Comput Model Eng Sci. 2010;62(2):150-170 https://doi.org/10.3970/cmes.2010.062.150
IEEE Style
X. Wang and J.D. Lee, “Concurrent Atomistic/Continuum Simulation of Thermo-Mechanical Coupling Phenomena,” Comput. Model. Eng. Sci., vol. 62, no. 2, pp. 150-170, 2010. https://doi.org/10.3970/cmes.2010.062.150



cc Copyright © 2010 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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