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Hybrid Finite Element and Volume Integral Methods for Scattering Using Parametric Geometry

by John L. Volakis1, Kubilay Sertel1, Erik Jørgensen2, Rick W. Kindt1

ElectroScience Laboratory, The Ohio State University, 1320 Kinear Rd., 43212, Columbus, OH.
Erik Jørgensen was at the University of Michigan. He is now at TICRA, Laederstraede 34 DK-1201 Copenhagen, DENMARK

Computer Modeling in Engineering & Sciences 2004, 5(5), 463-476. https://doi.org/10.3970/cmes.2004.005.463

Abstract

In this paper we address several topics relating to the development and implementation of volume integral and hybrid finite element methods for electromagnetic modeling. Comparisons of volume integral equation formulations with the finite element-boundary integral method are given in terms of accuracy and computing resources. We also discuss preconditioning and parallelization of the multilevel fast multipole method, and propose higher-order basis functions for curvilinear quadrilaterals and volumetric basis functions for curvilinear hexahedra. The latter have the desirable property of vanishing divergence within the element but non-zero curl. In addition, a new domain decomposition is introduced for solving array problems involving several million degrees of freedom. Three orders of magnitude CPU reduction is demonstrated for such applications.

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APA Style
Volakis, J.L., Sertel, K., Jørgensen, E., Kindt, R.W. (2004). Hybrid finite element and volume integral methods for scattering using parametric geometry. Computer Modeling in Engineering & Sciences, 5(5), 463-476. https://doi.org/10.3970/cmes.2004.005.463
Vancouver Style
Volakis JL, Sertel K, Jørgensen E, Kindt RW. Hybrid finite element and volume integral methods for scattering using parametric geometry. Comput Model Eng Sci. 2004;5(5):463-476 https://doi.org/10.3970/cmes.2004.005.463
IEEE Style
J. L. Volakis, K. Sertel, E. Jørgensen, and R. W. Kindt, “Hybrid Finite Element and Volume Integral Methods for Scattering Using Parametric Geometry,” Comput. Model. Eng. Sci., vol. 5, no. 5, pp. 463-476, 2004. https://doi.org/10.3970/cmes.2004.005.463



cc Copyright © 2004 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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