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Shape Memory Alloy: from Constitutive Modeling to Finite Element Analysis of Stent Deployment

by F. Auricchio1, A. Reali1

Department of Structural Mechanics, University of Pavia, Pavia, Italy.
European Centre for Training and Research in Earthquake Engineering (EUCENTRE), Pavia, Italy
Istituto di Matematica Applicata e Tecnologie Informatiche del CNR (IMATI), Pavia, Italy.
Centro di Simulazione Numerica Avanzata (CESNA), Pavia, Italy.
Institute Biomedical Technology (IBiTech), Ghent University, Ghent, Belgium.

Computer Modeling in Engineering & Sciences 2010, 57(3), 225-244. https://doi.org/10.3970/cmes.2010.057.225

Abstract

The use of shape memory alloys (SMA) in an increasing number of applications in many fields of engineering, and in particular in biomedical engineering, is leading to a growing interest toward an exhaustive modeling of their macroscopic behavior in order to construct reliable simulation tools for SMA-based devices. In this paper, we review the properties of a robust three-dimensional model able to reproduce both pseudo-elastic and shape-memory effect; then we calibrate the model parameters on experimental data and, finally, we exploit the model to perform the finite element analysis of pseudo-elastic Nitinol stent deployment in a simplified atherosclerotic artery model.

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APA Style
Auricchio, F., Contisup>1, M., 5, , Morgantisup>1, S., , et al. (2010). Shape memory alloy: from constitutive modeling to finite element analysis of stent deployment. Computer Modeling in Engineering & Sciences, 57(3), 225-244. https://doi.org/10.3970/cmes.2010.057.225
Vancouver Style
Auricchio F, Contisup>1 M, 5 , Morgantisup>1 S, , Reali A. Shape memory alloy: from constitutive modeling to finite element analysis of stent deployment. Comput Model Eng Sci. 2010;57(3):225-244 https://doi.org/10.3970/cmes.2010.057.225
IEEE Style
F. Auricchio, M. Contisup>1, 5, S. Morgantisup>1, , and A. Reali, “Shape Memory Alloy: from Constitutive Modeling to Finite Element Analysis of Stent Deployment,” Comput. Model. Eng. Sci., vol. 57, no. 3, pp. 225-244, 2010. https://doi.org/10.3970/cmes.2010.057.225



cc Copyright © 2010 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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