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Full-Field Analysis of a Functionally Graded Magnetoelectroelastic Nonhomogeneous Layered Half-Plane

by Chien-Ching Ma1, Jui-Mu Lee2

Corresponding author: Fax: +886-2-23631755, E-mail: ccma@ntu.edu.tw
Department of Mechanical Engineering, National Taiwan University, Taipei, Taiwan 10617, Republic of China

Computer Modeling in Engineering & Sciences 2009, 54(1), 87-120. https://doi.org/10.3970/cmes.2009.054.087

Abstract

In this study, the two-dimensional problem of elastic, electric, and magnetic fields induced by generalized line forces and screw dislocations applied in a functionally graded magnetoelectroelastic layered half-plane is analyzed. It is assumed that the material properties vary exponentially along the thickness direction. The full-field solutions for the transversely isotropic magnetoelectroelastic nonhomogeneous layered half-plane are obtained using the Fourier-transform technique. For the case that material properties are continuous at the interface, it is shown that all magnetoelectroelastic fields are continuous at the interface. Furthermore, this functionally graded layered half-plane has the identical contour slopes for the generalized stress \pmbsy(j)across the interface. Numerical results for the full-field distributions of generalized stresses and strains are presented and discussed in detail.

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APA Style
Ma, C., Lee, J. (2009). Full-field analysis of a functionally graded magnetoelectroelastic nonhomogeneous layered half-plane. Computer Modeling in Engineering & Sciences, 54(1), 87-120. https://doi.org/10.3970/cmes.2009.054.087
Vancouver Style
Ma C, Lee J. Full-field analysis of a functionally graded magnetoelectroelastic nonhomogeneous layered half-plane. Comput Model Eng Sci. 2009;54(1):87-120 https://doi.org/10.3970/cmes.2009.054.087
IEEE Style
C. Ma and J. Lee, “Full-Field Analysis of a Functionally Graded Magnetoelectroelastic Nonhomogeneous Layered Half-Plane,” Comput. Model. Eng. Sci., vol. 54, no. 1, pp. 87-120, 2009. https://doi.org/10.3970/cmes.2009.054.087



cc Copyright © 2009 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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