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Computational Simulation of Localized Damage by Finite Element Remeshing based on Bubble Packing Method

Soon Wan Chung1, Yoo Jin Choi1, Seung Jo Kim1

Department of Aerospace Engineering, Seoul National University, San 56-1, Shinlim-dong, Kwanak-ku, Seoul, 151-742, Korea.

Computer Modeling in Engineering & Sciences 2003, 4(6), 707-718. https://doi.org/10.3970/cmes.2003.004.707

Abstract

In this paper, an automatic finite element remeshing algorithm based on the bubble packing method is utilized for the purpose of numerical simulations of localized damage, because fine meshes are needed to represent the gradually concentrated damage. The bubble packing method introduces two parameters that easily control the remeshing criterion and the new mesh size. The refined area is determined by \textit {a posteriori} error estimation utilizing the value obtained from Superconvergent Patch Recovery. The isotropic ductile damage theory, founded on continuum damage mechanics, is used for this damage analysis. It was successfully shown in the numerical examples (upsetting and extrusion problems) that the remeshing algorithm generates fine and regular meshes for the regions with distorted meshes and that the damage is localized in the refined zone.

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APA Style
Chung, S.W., Choi, Y.J., Kim, S.J. (2003). Computational simulation of localized damage by finite element remeshing based on bubble packing method. Computer Modeling in Engineering & Sciences, 4(6), 707-718. https://doi.org/10.3970/cmes.2003.004.707
Vancouver Style
Chung SW, Choi YJ, Kim SJ. Computational simulation of localized damage by finite element remeshing based on bubble packing method. Comput Model Eng Sci. 2003;4(6):707-718 https://doi.org/10.3970/cmes.2003.004.707
IEEE Style
S.W. Chung, Y.J. Choi, and S.J. Kim, “Computational Simulation of Localized Damage by Finite Element Remeshing based on Bubble Packing Method,” Comput. Model. Eng. Sci., vol. 4, no. 6, pp. 707-718, 2003. https://doi.org/10.3970/cmes.2003.004.707



cc Copyright © 2003 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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