Open Access iconOpen Access

ARTICLE

Molecular-Dynamics Analysis of Grain-Boundary Grooving in Interconnect Films with Underlayers

T. Iwasaki1 and H. Miura1

1 Hitachi, Ltd., Tsuchiura, Ibaraki, Japan

TSP_CMES_551.pdf

  • 1426

    View

  • 1239

    Download

  • 0

    Like

Share Link