Submit

Login Login

Register Register

Home/ Journals/ CMES/ Vol.4, No.5, 2003/ 10.3970/cmes.2003.004.551

Open Access iconOpen Access

ARTICLE

Molecular-Dynamics Analysis of Grain-Boundary Grooving in Interconnect Films with Underlayers

T. Iwasaki1 and H. Miura1

1 Hitachi, Ltd., Tsuchiura, Ibaraki, Japan

TSP_CMES_551.pdf

  • 1284

    View

  • 1107

    Download

  • 0

    Like

Copyright© 2024 Tech Science Press
© 1997-2024 TSP (Henderson, USA) unless otherwise stated

Share Link