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Home/ Journals/ CMES/ Vol.4, No.5, 2003/ 10.3970/cmes.2003.004.551

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ARTICLE

Molecular-Dynamics Analysis of Grain-Boundary Grooving in Interconnect Films with Underlayers

T. Iwasaki1 and H. Miura1

1 Hitachi, Ltd., Tsuchiura, Ibaraki, Japan

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