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Sensitivity of the skin tissue on the activity of external heat sources

B. Mochnacki1, E. Majchrzak2

Institute of Mathematics and Computer Science, Technology University of Czestochowa, 42-200 Czestochowa, Dabrowskiego 68, Poland, e-mail: moch@matinf.pcz.czest.pl
Dept. for Strength of Materials and Computational Mechanics, Silesian University of Technology, 44-100 Gliwice, Konarskiego 18a, Poland, e-mail: maj@polsl.gliwice.pl

Computer Modeling in Engineering & Sciences 2003, 4(3&4), 431-438. https://doi.org/10.3970/cmes.2003.004.431

Abstract

In the paper the analysis of transient temperature field in the domain of biological tissue subjected to an external heat source is presented. Because of the geometrical features of the skin the heat exchange in domain considered is assumed to be one-dimensional. The thermophysical parameters of successive skin layers (dermis, epidermis and sub-cutaneous region) are different, at the same time in sub-domains of dermis and sub-cutaneous region the internal heat sources resulting from blood perfusion are taken into account. The degree of the skin burn results from the value of the so-called Henriques integrals. The first and the second order sensitivity of these integrals with respect to the thermophysical parameters are analyzed. On the stage of numerical computations the boundary element method has been used. In the final part of the paper the results of computations are shown.

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APA Style
Mochnacki, B., Majchrzak, E. (2003). Sensitivity of the skin tissue on the activity of external heat sources. Computer Modeling in Engineering & Sciences, 4(3&4), 431-438. https://doi.org/10.3970/cmes.2003.004.431
Vancouver Style
Mochnacki B, Majchrzak E. Sensitivity of the skin tissue on the activity of external heat sources. Comput Model Eng Sci. 2003;4(3&4):431-438 https://doi.org/10.3970/cmes.2003.004.431
IEEE Style
B. Mochnacki and E. Majchrzak, “Sensitivity of the skin tissue on the activity of external heat sources,” Comput. Model. Eng. Sci., vol. 4, no. 3&4, pp. 431-438, 2003. https://doi.org/10.3970/cmes.2003.004.431



cc Copyright © 2003 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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