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A Discrete Model for the High Frequency Elastic Wave Examination on Biological Tissue

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1 The Ohio State University, Columbus, OH, U.S.A.

Computer Modeling in Engineering & Sciences 2003, 4(3&4), 421-430. https://doi.org/10.3970/cmes.2003.004.421

Abstract

A microstructure-accounting mechanical field theory approach is applied to the problem of reflection from a granular thin layer embedded between two solid substrates to study the direct relationship of the micro-structural parameters and the overall reflection coefficients of the thin layer. The exact solution for plane wave reflection coefficients is derived under the new theoretical framework giving quantitative relations between the macroscopic reflection coefficients and a set of micro structural/physical parameters including particle size and micromoduli. The model was analyzed using averaged material properties of biological tissue for the granular thin layer. It was demonstrated that changes in micro-level physical and geometrical parameters affect the reflectivity of the thin layer. The results indicate that it is possible to quantitatively determine micro-parameters of the embedded granular material if the reflection spectra are experimentally determined. The effects of micro-parameters also suggest that the discrete representation of biological tissue might be advantageous in modeling its biomechanical responses.

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APA Style
Liu, J., Ferrari, M. (2003). A discrete model for the high frequency elastic wave examination on biological tissue. Computer Modeling in Engineering & Sciences, 4(3&4), 421-430. https://doi.org/10.3970/cmes.2003.004.421
Vancouver Style
Liu J, Ferrari M. A discrete model for the high frequency elastic wave examination on biological tissue. Comput Model Eng Sci. 2003;4(3&4):421-430 https://doi.org/10.3970/cmes.2003.004.421
IEEE Style
J. Liu and M. Ferrari, “A Discrete Model for the High Frequency Elastic Wave Examination on Biological Tissue,” Comput. Model. Eng. Sci., vol. 4, no. 3&4, pp. 421-430, 2003. https://doi.org/10.3970/cmes.2003.004.421



cc Copyright © 2003 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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