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Structural and Tensile Properties of Self-Assembled DNA Network on Mica Surface

by Itsuo Hanasaki, Hirofumi Shintaku, Satoshi MatsunamiSatoyuki Kawano1

Department of Mechanical Science and Bioengineering, Graduate School of Engineering Science, Osaka University, Machikaneyama-cho 1-3, Toyonaka, Osaka 560-8531, Japan

Computer Modeling in Engineering & Sciences 2009, 46(2), 191-208. https://doi.org/10.3970/cmes.2009.046.191

Abstract

Self-assembly is one of the physical phenomena that are promising for the manufacturing process of the devices on which DNA molecules are mounted as the components. We have conducted a structural study of self-assembled poly(dA)\discretionary poly(dT) DNA networks on mica surface to discuss the design requirements. The results indicate that the network formation process consists of the adsorption and the subsequent coarsening. The final form of the component filaments are roughly straight. These characteristics imply the possible tensile loads during the network formation. Therefore, we have conducted molecular dynamics simulations of tensile tests of a short DNA fragment to elucidate the relevant mechanical properties. The effective tensile properties strongly depend on the loading condition of the clamp, which can affect the functionality of the molecules.

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APA Style
Hanasaki, I., Shintaku, H., Matsunami, S., Kawano, S. (2009). Structural and tensile properties of self-assembled DNA network on mica surface. Computer Modeling in Engineering & Sciences, 46(2), 191-208. https://doi.org/10.3970/cmes.2009.046.191
Vancouver Style
Hanasaki I, Shintaku H, Matsunami S, Kawano S. Structural and tensile properties of self-assembled DNA network on mica surface. Comput Model Eng Sci. 2009;46(2):191-208 https://doi.org/10.3970/cmes.2009.046.191
IEEE Style
I. Hanasaki, H. Shintaku, S. Matsunami, and S. Kawano, “Structural and Tensile Properties of Self-Assembled DNA Network on Mica Surface,” Comput. Model. Eng. Sci., vol. 46, no. 2, pp. 191-208, 2009. https://doi.org/10.3970/cmes.2009.046.191



cc Copyright © 2009 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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