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Numerical Modeling of Short-Pulse Laser Interactions with Multi-Layered Thin Metal Films

E. Majchrzak1, B. Mochnacki2, A. L. Greer3, J. S. Suchy4

Silesian University of Technology, 44-100 Gliwice, Konarskiego 18a, Poland. e-mail: ewa.majchrzak@polsl.pl (corresponding author)
Czestochowa University of Technology, Dabrowskiego 71, 42-200 Czestochowa, Poland
University of Cambridge, Penbroke Street, Cambridge, CB23QZ, UK
AGH University of Science and Technology, 30-059 Cracow, Poland

Computer Modeling in Engineering & Sciences 2009, 41(2), 131-146. https://doi.org/10.3970/cmes.2009.041.131

Abstract

Multi-layered thin metal film subjected to a short-pulse laser heating is considered. Mathematical description of the process discussed bases on the equation in which there appear the relaxation time and the thermalization time (dual-phase-lag-model). In this study we develop a three level implicit finite difference scheme for numerical modelling of heat transfer in non-homogeneous metal film. At the interfaces an ideal contact between successive layers is assumed. At the stage of computations a solution of only one three-diagonal linear system corresponds to transition from time t to t + Δt. The mathematical model, numerical algorithm and examples of computations are presented in the paper.

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APA Style
Majchrzak, E., Mochnacki, B., Greer, A.L., Suchy, J.S. (2009). Numerical modeling of short-pulse laser interactions with multi-layered thin metal films. Computer Modeling in Engineering & Sciences, 41(2), 131-146. https://doi.org/10.3970/cmes.2009.041.131
Vancouver Style
Majchrzak E, Mochnacki B, Greer AL, Suchy JS. Numerical modeling of short-pulse laser interactions with multi-layered thin metal films. Comput Model Eng Sci. 2009;41(2):131-146 https://doi.org/10.3970/cmes.2009.041.131
IEEE Style
E. Majchrzak, B. Mochnacki, A.L. Greer, and J.S. Suchy, “Numerical Modeling of Short-Pulse Laser Interactions with Multi-Layered Thin Metal Films,” Comput. Model. Eng. Sci., vol. 41, no. 2, pp. 131-146, 2009. https://doi.org/10.3970/cmes.2009.041.131



cc Copyright © 2009 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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