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Computational Simulations of Micro-Indentation Tests Using Gradient Plasticity

Jian Chen1, Huang Yuan2, Folker H. Wittmann3

Current address: ALSTOM Power (Schweiz) AG,
CH-5401 Baden, Switzerland
Corresponding author.
Tel.: +49-89-1489 9294;
fax: +49-89-1489 2728;
E-mail: huang.yuan@muc.mtu.de.
Current address: MTU Aero Engines München,
D-80995 Munich, Germany
Lab. for Materials Behaviour,
Paul Scherrer Institute,
CH-5232 Villigen PSI, Switzerland
Institute for Building Materials,
ETH Zürich, CH-8093
Zürich-Hönggerberg, Switzerland

Computer Modeling in Engineering & Sciences 2002, 3(6), 743-754. https://doi.org/10.3970/cmes.2002.003.743

Abstract

Experimental observation confirms that micro-hardness of metallic materials depends significantly on the indentation depth. In the present paper we discuss simulations of micro-indentation tests based on the gradient plasticity model using the finite element method. The role of intrinsic material length parameters in the gradient plasticity model is investigated. The computational results confirm that the gradient plasticity model is suitable to simulate micro-indentation tests and predicts the depth-dependent hardness in micro- and nano-indentations. Variations of micro-hardness is correlated with the intrinsic material length parameters.

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Cite This Article

APA Style
Chen, J., Yuan, H., Wittmann, F.H. (2002). Computational simulations of micro-indentation tests using gradient plasticity. Computer Modeling in Engineering & Sciences, 3(6), 743-754. https://doi.org/10.3970/cmes.2002.003.743
Vancouver Style
Chen J, Yuan H, Wittmann FH. Computational simulations of micro-indentation tests using gradient plasticity. Comput Model Eng Sci. 2002;3(6):743-754 https://doi.org/10.3970/cmes.2002.003.743
IEEE Style
J. Chen, H. Yuan, and F.H. Wittmann, “Computational Simulations of Micro-Indentation Tests Using Gradient Plasticity,” Comput. Model. Eng. Sci., vol. 3, no. 6, pp. 743-754, 2002. https://doi.org/10.3970/cmes.2002.003.743



cc Copyright © 2002 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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