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Piecewise Linear Models for Interfaces and Mixed Mode Cohesive Cracks1

by G. Cocchetti2, G. Maier2, X. P. Shen3

Dedicated to Professor Kaspar Willam on the occasion of his 60th anniversary.
Department of Structural Engineering, Technical University (Politecnico) of Milan, Italy.
On leave from Department of Mechanics, College of Science, Northeastern University, Shenyang, China.

Computer Modeling in Engineering & Sciences 2002, 3(3), 279-298. https://doi.org/10.3970/cmes.2002.003.279

Abstract

Interface models mean here relationships between displacement jumps and tractions across a locus of displacement discontinuities. Frictional contact and quasi-brittle fracture interpreted by cohesive crack models are typical mechanical situations concerned by the present unifying approach. Plastic-softening multidissipative interface models are studied in piecewise linear formats, i.e. assuming linearity for yield functions, plastic potentials and relationships between static and kinematic internal variables. The properties and the pros and cons of such simplified models in a variety of formulations (fully non-holonomic in rates, holonomic and in finite steps), all mathematically described as linear complementarity problems, are comparatively investigated in view of overall analyses of structures (like e.g. concrete dams) which include joints and/or are exposed to quasi-brittle fracture processes.

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APA Style
Cocchetti, G., Maier, G., Shen, X.P. (2002). Piecewise linear models for interfaces and mixed mode cohesive cracks1. Computer Modeling in Engineering & Sciences, 3(3), 279-298. https://doi.org/10.3970/cmes.2002.003.279
Vancouver Style
Cocchetti G, Maier G, Shen XP. Piecewise linear models for interfaces and mixed mode cohesive cracks1. Comput Model Eng Sci. 2002;3(3):279-298 https://doi.org/10.3970/cmes.2002.003.279
IEEE Style
G. Cocchetti, G. Maier, and X. P. Shen, “Piecewise Linear Models for Interfaces and Mixed Mode Cohesive Cracks1,” Comput. Model. Eng. Sci., vol. 3, no. 3, pp. 279-298, 2002. https://doi.org/10.3970/cmes.2002.003.279



cc Copyright © 2002 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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