Open Access

ARTICLE

Fast analysis system for embossing process simulation of commemorative coin--CoinForm

J. P. Xu¹, Y. Q. Liu^1,2, S. Q. Li³, S. C. Wu⁴

1 State Key Laboratory of Material Processing and Die & Mould Technology, Huazhong University of Science and Technology, Wuhan, 430074, PR China
2 Corresponding author at: State Key Laboratory of Material Processing and Die & Mould Technology, Huazhong University of Science & Technology, 1037 Luoyu Road, Wuhan Hubei 430074, PR China. Tel.: +86 27 87558193; fax: +86 27 87554405; Email: fastamp@vip.sina.com (Liu Yuqi)
3 Shenyang Mint, Shenyang, 110042, PR China
4 School of Materials Science and Engineering, Hefei University of Technology, Hefei, 230009, PR China