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A Post-Processing Scheme to Evaluate Transverse Stresses for Composite Panels under Dynamic Loads

K. Lee1, H. Park2, S.W. Lee3

Assistant Research Scientist, University of Maryland, College Park, MD, USA.
Senior Research Engineer, Hyundai Motor Company, Republic of Korea.
Professor, Aerospace Engineering, University of Maryland, College Park, MD, USA.

Computer Modeling in Engineering & Sciences 2008, 32(3), 113-122. https://doi.org/10.3970/cmes.2008.032.113

Abstract

A post-processing scheme is presented to accurately determine transverse shear and normal stresses in composite panels undergoing geometrically nonlinear deformation under dynamic loading conditions. Transverse stresses are assumed through thickness at a point of interest and are recovered via a one-dimensional finite element method. The finite element method is based on the least square functional of the error in the equilibrium equation along the thickness direction and utilizes the in-plane stresses and resultant transverse shear forces per unit length obtained by a shell element analysis. Numerical results demonstrate that, with minimal addition of computational efforts, the present post-processing approach can be used to accurately determine the time history of transverse stresses at a point of interest in composite structures under dynamic loading.

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APA Style
Lee, K., Park, H., Lee, S. (2008). A post-processing scheme to evaluate transverse stresses for composite panels under dynamic loads. Computer Modeling in Engineering & Sciences, 32(3), 113-122. https://doi.org/10.3970/cmes.2008.032.113
Vancouver Style
Lee K, Park H, Lee S. A post-processing scheme to evaluate transverse stresses for composite panels under dynamic loads. Comput Model Eng Sci. 2008;32(3):113-122 https://doi.org/10.3970/cmes.2008.032.113
IEEE Style
K. Lee, H. Park, and S. Lee, “A Post-Processing Scheme to Evaluate Transverse Stresses for Composite Panels under Dynamic Loads,” Comput. Model. Eng. Sci., vol. 32, no. 3, pp. 113-122, 2008. https://doi.org/10.3970/cmes.2008.032.113



cc Copyright © 2008 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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