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A Cell-less BEM Formulation for 2D and 3D Elastoplastic Problems Using Particular Integrals

A. Owatsiriwong1, B. Phansri1, K.H. Park1,2

School of Engineering & Technology, Asian Instituteof Technology, P.O. Box 4, Klong Luang, Pathumthani 12120, Thailand
Corresponding author. Tel.: 66-2-524-5508; Fax: 66-2-524-5509. E-mail: khpark@ait.ac.th

Computer Modeling in Engineering & Sciences 2008, 31(1), 37-60. https://doi.org/10.3970/cmes.2008.031.037

Abstract

This study deals with the particular integral formulation for two (2D) and three (3D) dimensional elastoplastic analyses. The elastostatic equation is used for the complementary solution. The particular integrals for displacement, stress and traction rates are derived by introducing the concept of global shape function to approximate an initial stress rate term of the inhomogeneous equation. The Newton-Raphson algorithm for the plastic multiplier is used to solve the system equation. The developed program is integrated with the pre- and post-processor. The collapse analyses of the smooth flexible strip, square and circular footings are given by comparing the numerical results of the load-displacement response with those by other BEM and FEM programs. The results of evolution of plastic region and deformed shape with increasing load are also given to demonstrate the application and accuracy of the present formulation.

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APA Style
Owatsiriwong, A., Phansri, B., Park, K. (2008). A cell-less BEM formulation for 2D and 3D elastoplastic problems using particular integrals. Computer Modeling in Engineering & Sciences, 31(1), 37-60. https://doi.org/10.3970/cmes.2008.031.037
Vancouver Style
Owatsiriwong A, Phansri B, Park K. A cell-less BEM formulation for 2D and 3D elastoplastic problems using particular integrals. Comput Model Eng Sci. 2008;31(1):37-60 https://doi.org/10.3970/cmes.2008.031.037
IEEE Style
A. Owatsiriwong, B. Phansri, and K. Park, “A Cell-less BEM Formulation for 2D and 3D Elastoplastic Problems Using Particular Integrals,” Comput. Model. Eng. Sci., vol. 31, no. 1, pp. 37-60, 2008. https://doi.org/10.3970/cmes.2008.031.037



cc Copyright © 2008 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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