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The MLPG Mixed Collocation Method for Material Orientation and Topology Optimization of Anisotropic Solids and Structures

by Shu Li1, S. N. Atluri2

Department of Aircraft Engineering, Beijing University of Aeronautics and Astronautics, Beijing 100083, P.R. China
Center for Aerospace Research & Education, University of California, Irvine, USA

Computer Modeling in Engineering & Sciences 2008, 30(1), 37-56. https://doi.org/10.3970/cmes.2008.030.037

Abstract

In this paper, a method based on a combination of an optimization of directions of orthotropy, along with topology optimization, is applied to continuum orthotropic solids with the objective of minimizing their compliance. The spatial discretization algorithm is the so called Meshless Local Petrov-Galerkin (MLPG) "mixed collocation'' method for the design domain, and the material-orthotropy orientation angles and the nodal volume fractions are used as the design variables in material optimization and topology optimization, respectively. Filtering after each iteration diminishes the checkerboard effect in the topology optimization problem. The example results are provided to illustrate the effects of the orthotropic material characteristics in structural topology-optimization.

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APA Style
Li, S., Atluri, S.N. (2008). The MLPG mixed collocation method for material orientation and topology optimization of anisotropic solids and structures. Computer Modeling in Engineering & Sciences, 30(1), 37-56. https://doi.org/10.3970/cmes.2008.030.037
Vancouver Style
Li S, Atluri SN. The MLPG mixed collocation method for material orientation and topology optimization of anisotropic solids and structures. Comput Model Eng Sci. 2008;30(1):37-56 https://doi.org/10.3970/cmes.2008.030.037
IEEE Style
S. Li and S. N. Atluri, “The MLPG Mixed Collocation Method for Material Orientation and Topology Optimization of Anisotropic Solids and Structures,” Comput. Model. Eng. Sci., vol. 30, no. 1, pp. 37-56, 2008. https://doi.org/10.3970/cmes.2008.030.037



cc Copyright © 2008 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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