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2.5D Green's Functions for Elastodynamic Problems in Layered Acoustic and Elastic Formations

António Tadeu, Julieta António1

DEC-FCTUC,Coimbra,Portugal.

Computer Modeling in Engineering & Sciences 2001, 2(4), 477-496. https://doi.org/10.3970/cmes.2001.002.477

Abstract

This paper presents analytical solutions, together with explicit expressions, for the steady state response of homogeneous three-dimensional layered acoustic and elastic formations subjected to a spatially sinusoidal harmonic line load. These formulas are theoretically interesting in themselves and they are also useful as benchmark solutions for numerical applications. In particular, they are very important in formulating three-dimensional elastodynamic problems in layered fluid and solid formations using integral transform methods and/or boundary elements, avoiding the discretization of the solid-fluid interfaces. The proposed Green's functions will allow the solution to be obtained for high frequencies, for which the conventional boundary elements' solution would require an inordinate computational effort, ruling out its use. In order to validate the final expressions, the results were compared with those provided by the Boundary Element Method (BEM) solution, for which the interfaces between layers are discretized with boundary elements.

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APA Style
Tadeu, A., António, J. (2001). 2.5D green's functions for elastodynamic problems in layered acoustic and elastic formations. Computer Modeling in Engineering & Sciences, 2(4), 477-496. https://doi.org/10.3970/cmes.2001.002.477
Vancouver Style
Tadeu A, António J. 2.5D green's functions for elastodynamic problems in layered acoustic and elastic formations. Comput Model Eng Sci. 2001;2(4):477-496 https://doi.org/10.3970/cmes.2001.002.477
IEEE Style
A. Tadeu and J. António, “2.5D Green's Functions for Elastodynamic Problems in Layered Acoustic and Elastic Formations,” Comput. Model. Eng. Sci., vol. 2, no. 4, pp. 477-496, 2001. https://doi.org/10.3970/cmes.2001.002.477



cc Copyright © 2001 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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