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A Pure Contour Formulation for the Meshless Local Boundary Integral Equation Method in Thermoelasticity

by J. Sladek1, V. Sladek1, S.N. Atluri2

Institute of Construction and Architecture, Slovak Academy of Sciences, 842 20 Bratislava, Slovakia
Center for Aerospace Research & Education, 7704 Boelter Hall, University of California at Los Angeles, Los Angeles, CA 90095-1600, USA

Computer Modeling in Engineering & Sciences 2001, 2(4), 423-434. https://doi.org/10.3970/cmes.2001.002.423

Abstract

A new meshless method for solving stationary thermoelastic boundary value problems is proposed in the present paper. The moving least square (MLS) method is used for the approximation of physical quantities in the local boundary integral equations (LBIE). In stationary thermoelasticity, the temperature and displacement fields are uncoupled. In the first step, the temperature field, described by the Laplace equation, is analysed by the LBIE. Then, the mechanical quantities are obtained from the solution of the LBIEs, which are reduced to elastostatic ones with redefined body forces due to thermal loading. The domain integrals with temperature gradients are transformed to boundary integrals. Numerical examples illustrate the implementation and performance of the present method.

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APA Style
Sladek, J., Sladek, V., Atluri, S. (2001). A pure contour formulation for the meshless local boundary integral equation method in thermoelasticity. Computer Modeling in Engineering & Sciences, 2(4), 423-434. https://doi.org/10.3970/cmes.2001.002.423
Vancouver Style
Sladek J, Sladek V, Atluri S. A pure contour formulation for the meshless local boundary integral equation method in thermoelasticity. Comput Model Eng Sci. 2001;2(4):423-434 https://doi.org/10.3970/cmes.2001.002.423
IEEE Style
J. Sladek, V. Sladek, and S. Atluri, “A Pure Contour Formulation for the Meshless Local Boundary Integral Equation Method in Thermoelasticity,” Comput. Model. Eng. Sci., vol. 2, no. 4, pp. 423-434, 2001. https://doi.org/10.3970/cmes.2001.002.423



cc Copyright © 2001 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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