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Determination of Crack Tip Fields in Linear Elastostatics by the Meshless Local Petrov-Galerkin (MLPG) Method

H.-K. Ching, R. C. Batra1

Department of Engineering Science and Mechanics, MC 0219
Virginia Polytechnic Institute and State University
Blacksburg, VA 24061, USA

Computer Modeling in Engineering & Sciences 2001, 2(2), 273-290. https://doi.org/10.3970/cmes.2001.002.273

Abstract

It is shown that the MLPG method augmented with the enriched basis functions and either the visibility criterion or the diffraction criterion successfully predicts the singular stress fields near a crack tip. Results are presented for a single edge-cracked plate and a double edge-cracked plate with plate edges parallel to the crack axis loaded in tension, the single edge-cracked plate with one plate edge parallel to the crack axis clamped and the other loaded by tangential tractions, and for a double edge-notched plate with the side between the notches loaded in compression. For the first three problems, the stress intensity factors computed with the equivalent domain and the contour integrals are found to agree well with those available in the literature. For the edge-notched plate, results computed with the MLPG method agree well with those obtained from the finite element method.

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APA Style
Ching, H., Batra, R.C. (2001). Determination of crack tip fields in linear elastostatics by the meshless local petrov-galerkin (MLPG) method. Computer Modeling in Engineering & Sciences, 2(2), 273-290. https://doi.org/10.3970/cmes.2001.002.273
Vancouver Style
Ching H, Batra RC. Determination of crack tip fields in linear elastostatics by the meshless local petrov-galerkin (MLPG) method. Comput Model Eng Sci. 2001;2(2):273-290 https://doi.org/10.3970/cmes.2001.002.273
IEEE Style
H. Ching and R.C. Batra, “Determination of Crack Tip Fields in Linear Elastostatics by the Meshless Local Petrov-Galerkin (MLPG) Method,” Comput. Model. Eng. Sci., vol. 2, no. 2, pp. 273-290, 2001. https://doi.org/10.3970/cmes.2001.002.273



cc Copyright © 2001 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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