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Thermal Bending of Reissner-Mindlin Plates by the MLPG

J. Sladek1, V. Sladek1, P. Solek2, P.H. Wen3

Institute of Construction and Architecture, Slovak Academy of Sciences, 84503 Bratislava, Slovakia
Department of Mechanics, Slovak Technical University, Bratislava, Slovakia
School of Engineering and Materials Sciences, Queen Mary University of London, Mile End, London E14NS, U.K.

Computer Modeling in Engineering & Sciences 2008, 28(1), 57-76. https://doi.org/10.3970/cmes.2008.028.057

Abstract

A meshless local Petrov-Galerkin (MLPG) method is applied to solve thermal bending problems described by the Reissner-Mindlin theory. Both stationary and thermal shock loads are analyzed here. Functionally graded material properties with continuous variation in the plate thickness direction are considered here. The Laplace-transformation is used to treat the time dependence of the variables for transient problems. A weak formulation for the set of governing equations in the Reissner-Mindlin theory is transformed into local integral equations on local subdomains in the mean surface of the plate by using a unit test function. Nodal points are randomly spread on the surface of the plate and each node is surrounded by a circular subdomain to which local integral equations are applied. The meshless approximation based on the Moving Least-Squares (MLS) method is employed for the implementation.

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APA Style
Sladek, J., Sladek, V., Solek, P., Wen, P. (2008). Thermal bending of reissner-mindlin plates by the MLPG. Computer Modeling in Engineering & Sciences, 28(1), 57-76. https://doi.org/10.3970/cmes.2008.028.057
Vancouver Style
Sladek J, Sladek V, Solek P, Wen P. Thermal bending of reissner-mindlin plates by the MLPG. Comput Model Eng Sci. 2008;28(1):57-76 https://doi.org/10.3970/cmes.2008.028.057
IEEE Style
J. Sladek, V. Sladek, P. Solek, and P. Wen, “Thermal Bending of Reissner-Mindlin Plates by the MLPG,” Comput. Model. Eng. Sci., vol. 28, no. 1, pp. 57-76, 2008. https://doi.org/10.3970/cmes.2008.028.057



cc Copyright © 2008 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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