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Configuration Maintenance of Inflated Membrane Structures Using SMA Film Actuators

Jin-Ho Roh1, In Lee2

Research Engineer, Department of Mechanical Engineering, The Pennsylvania State University, USA, jzr13@psu.edu
Corresponding author. Department of Aerospace Engineering, Korea Advanced Institute of Science and Technology, Korea, inlee@kaist.ac.kr

Computer Modeling in Engineering & Sciences 2008, 26(1), 13-30. https://doi.org/10.3970/cmes.2008.026.013

Abstract

A methodology to maintain the configuration of inflated membrane structures using shape memory alloy (SMA) film actuator is numerically investigated. The two- dimensional incremental formulation of the SMA constitutive model is developed. New parameters related to the thermodynamic energy equation are introduced to describe more general behaviors of the SMA film. With numerical algorithm of wrinkling and SMAs, the interactions between the inflated membrane structure and the SMA film are investigated by using a finite element program. The effectiveness of SMA film to control the configuration of an inflated membrane structure is examined. To demonstrate surface configuration control, two inflatable membrane structures, each with SMA film are used: (1) an inflatable boom similar to a strut supporting structure and (2) an inflatable reflector, which is comprised of two inflated membranes and torus supporting structures.

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Cite This Article

APA Style
Roh, J., Lee, I. (2008). Configuration maintenance of inflated membrane structures using SMA film actuators. Computer Modeling in Engineering & Sciences, 26(1), 13-30. https://doi.org/10.3970/cmes.2008.026.013
Vancouver Style
Roh J, Lee I. Configuration maintenance of inflated membrane structures using SMA film actuators. Comput Model Eng Sci. 2008;26(1):13-30 https://doi.org/10.3970/cmes.2008.026.013
IEEE Style
J. Roh and I. Lee, “Configuration Maintenance of Inflated Membrane Structures Using SMA Film Actuators,” Comput. Model. Eng. Sci., vol. 26, no. 1, pp. 13-30, 2008. https://doi.org/10.3970/cmes.2008.026.013



cc Copyright © 2008 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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