Open Access

ARTICLE

Modelling and Validation of Contribions to Stress in the Shallow Trench Isolation Process Sequence

K. Garikipati¹, V.S. Rao², M.Y. Hao³, E. Ibok⁴, I. de Wolf⁵, R. W. Dutton⁶

1 Stanford University, Stanford, California
2 Schlumberger Cambridge Research Centre, Cambridge, UK
3 Advanced Micro Devices Inc., Santa Clara, California
4 Advanced Micro Devices Inc., Santa Clara, California
5 Interuniversity Micro-electronics Center, Leuven, Belgium
6 Stanford University, Stanford, California