Table of Content

Open Access iconOpen Access

ARTICLE

Finite Element Analysis of Particle Assembly-water Coupled Frictional Contact Problem

by S. Ozaki1, K. Hashiguchi2, T. Okayasu2, D.H. Chen1

Tokyo University of Science, Kudankita 1-14-6, Chiyodaku, Tokyo, Japan.
Kyushu University, Hakozaki 6-10-1, Higashiku, Fukuoka, Japan.

Computer Modeling in Engineering & Sciences 2007, 18(2), 101-120. https://doi.org/10.3970/cmes.2007.018.101

Abstract

In order to analyze precisely not only the elastoplastic deformation phenomenon of saturated particle assembly such as soils, grains, powdered and tablet medicines or three dimensional cellular materials, but also the frictional sliding phenomenon between saturated particle assembly and other bodies, a particle assembly-water coupled finite element program, that incorporates both the subloading surface and the subloading-friction models, is developed. Subsequently, simulations of the compaction behavior of saturated particle assembly under strain rate control are performed. It is revealed by the numerical experiment adopting the finite element program that the frictional sliding behavior of the contact boundary influences both the deformation behavior and the pore water flow behavior in the saturated particle assembly.

Keywords


Cite This Article

APA Style
Ozaki, S., Hashiguchi, K., Okayasu, T., Chen, D. (2007). Finite element analysis of particle assembly-water coupled frictional contact problem. Computer Modeling in Engineering & Sciences, 18(2), 101-120. https://doi.org/10.3970/cmes.2007.018.101
Vancouver Style
Ozaki S, Hashiguchi K, Okayasu T, Chen D. Finite element analysis of particle assembly-water coupled frictional contact problem. Comput Model Eng Sci. 2007;18(2):101-120 https://doi.org/10.3970/cmes.2007.018.101
IEEE Style
S. Ozaki, K. Hashiguchi, T. Okayasu, and D. Chen, “Finite Element Analysis of Particle Assembly-water Coupled Frictional Contact Problem,” Comput. Model. Eng. Sci., vol. 18, no. 2, pp. 101-120, 2007. https://doi.org/10.3970/cmes.2007.018.101



cc Copyright © 2007 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
  • 1544

    View

  • 1151

    Download

  • 0

    Like

Share Link