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Three-Dimensional Dynamic Fracture Analysis Using the Material Point Method

by Y. J. Guo1, J. A. Nairn2

Material Science & Engineering, University of Utah, Salt Lake City, Utah 84112, USA
Wood Science & Engineering, Oregon State University, Corvallis, OR, 97331, USA

Computer Modeling in Engineering & Sciences 2006, 16(3), 141-156. https://doi.org/10.3970/cmes.2006.016.141

Abstract

This paper describes algorithms for three-dimensional dynamic stress and fracture analysis using the material point method (MPM). By allowing dual velocity fields at background grid nodes, the method provides exact numerical implementation of explicit cracks in a predominantly meshless method. Crack contact schemes were included for automatically preventing crack surfaces from interpenetration. Crack-tip parameters, dynamic$J$-integral vector and mode I, II, and III stress intensity factors, were calculated from the dynamic stress solution. Comparisons to finite difference method (FDM), finite element method (FEM), and boundary element method (BEM), as well as to static theories showed that MPM can efficiently and accurately solve three-dimensional dynamic fracture problems. Since the crack description is independent of the object description, MPM could be useful for simulation of three-dimensional dynamic crack propagation in arbitrary directions.

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Cite This Article

APA Style
Guo, Y.J., Nairn, J.A. (2006). Three-dimensional dynamic fracture analysis using the material point method. Computer Modeling in Engineering & Sciences, 16(3), 141-156. https://doi.org/10.3970/cmes.2006.016.141
Vancouver Style
Guo YJ, Nairn JA. Three-dimensional dynamic fracture analysis using the material point method. Comput Model Eng Sci. 2006;16(3):141-156 https://doi.org/10.3970/cmes.2006.016.141
IEEE Style
Y. J. Guo and J. A. Nairn, “Three-Dimensional Dynamic Fracture Analysis Using the Material Point Method,” Comput. Model. Eng. Sci., vol. 16, no. 3, pp. 141-156, 2006. https://doi.org/10.3970/cmes.2006.016.141



cc Copyright © 2006 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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