Open Access

ARTICLE

Magneto-Photo-Thermoelastic Excitation Rotating Semiconductor Medium Based on Moisture Diffusivity

by Khaled Lotfy^1,2, A. M. S. Mahdy^3,*, Alaa A. El-Bary⁴, E. S. Elidy¹

1 Department of Mathematics, Faculty of Science, Zagazig University, Zagazig, 44519, Egypt
2 Department of Mathematics, Faculty of Science, Taibah University, Madinah, 42353, Saudi Arabia
3 Department of Mathematics and Statistics, College of Science, Taif University, Taif, 11099, Saudi Arabia
4 Arab Academy for Science, Technology and Maritime Transport, Alexandria, 1029, Egypt

* Corresponding Author: A. M. S. Mahdy. Email:

Computer Modeling in Engineering & Sciences 2024, 141(1), 107-126. https://doi.org/10.32604/cmes.2024.053199

Received 27 April 2024; Accepted 21 June 2024; Issue published 20 August 2024

Abstract

In this research, we focus on the free-surface deformation of a one-dimensional elastic semiconductor medium as a function of magnetic field and moisture diffusivity. The problem aims to analyze the interconnection between plasma and moisture diffusivity processes, as well as thermo-elastic waves. The study examines the photo-thermoelasticity transport process while considering the impact of moisture diffusivity. By employing Laplace’s transformation technique, we derive the governing equations of the photo-thermo-elastic medium. These equations include the equations for carrier density, elastic waves, moisture transport, heat conduction, and constitutive relationships. Mechanical stresses, thermal conditions, and plasma boundary conditions are used to calculate the fundamental physical parameters in the Laplace domain. By employing numerical techniques, the Laplace transform is inverted to get complete time-domain solutions for the primary physical domains under study. Reference moisture, thermoelastic, and thermoelectric characteristics are employed in conjunction with a graphical analysis that takes into consideration the effects of applied forces on displacement, moisture concentration, carrier density, stress due to forces, and temperature distribution.

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Keywords

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