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An Elastoplastic Fracture Model Based on Bond-Based Peridynamics

by Liping Zu1, Yaxun Liu1, Haoran Zhang1, Lisheng Liu2,*, Xin Lai2,*, Hai Mei2

1 Department of Engineering Structure and Mechanics, Wuhan University of Technology, Wuhan, 430070, China
2 Hubei Key Laboratory of Theory and Application of Advanced Materials Mechanics, Wuhan University of Technology, Wuhan, 430070, China

* Corresponding Authors: Lisheng Liu. Email: email; Xin Lai. Email: email

Computer Modeling in Engineering & Sciences 2024, 140(3), 2349-2371. https://doi.org/10.32604/cmes.2024.050488

Abstract

Fracture in ductile materials often occurs in conjunction with plastic deformation. However, in the bond-based peridynamic (BB-PD) theory, the classic mechanical stress is not defined inherently. This makes it difficult to describe plasticity directly using the classical plastic theory. To address the above issue, a unified bond-based peridynamics model was proposed as an effective tool to solve elastoplastic fracture problems. Compared to the existing models, the proposed model directly describes the elastoplastic theory at the bond level without the need for additional calculation means. The results obtained in the context of this model are shown to be consistent with FEM results in regard to force-displacement curves, displacement fields, stress fields, and plastic deformation regions. The model exhibits good capability of capturing crack propagation in ductile material failure problems.

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APA Style
Zu, L., Liu, Y., Zhang, H., Liu, L., Lai, X. et al. (2024). An elastoplastic fracture model based on bond-based peridynamics. Computer Modeling in Engineering & Sciences, 140(3), 2349-2371. https://doi.org/10.32604/cmes.2024.050488
Vancouver Style
Zu L, Liu Y, Zhang H, Liu L, Lai X, Mei H. An elastoplastic fracture model based on bond-based peridynamics. Comput Model Eng Sci. 2024;140(3):2349-2371 https://doi.org/10.32604/cmes.2024.050488
IEEE Style
L. Zu, Y. Liu, H. Zhang, L. Liu, X. Lai, and H. Mei, “An Elastoplastic Fracture Model Based on Bond-Based Peridynamics,” Comput. Model. Eng. Sci., vol. 140, no. 3, pp. 2349-2371, 2024. https://doi.org/10.32604/cmes.2024.050488



cc Copyright © 2024 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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