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ARTICLE
Boundary Element Analysis for Mode III Crack Problems of Thin-Walled Structures from Micro- to Nano-Scales
Bingrui Ju1, Wenzhen Qu1,2,*, Yan Gu1,2
1
School of Mathematics and Statistics, Qingdao University, Qingdao, 266071, China
2
Institute of Mechanics for Multifunctional Materials and Structures, Qingdao University, Qingdao, 266071, China
* Corresponding Author: Wenzhen Qu. Email:
(This article belongs to the Special Issue: Advances on Mesh and Dimension Reduction Methods)
Computer Modeling in Engineering & Sciences 2023, 136(3), 2677-2690. https://doi.org/10.32604/cmes.2023.025886
Received 03 August 2022; Accepted 25 October 2022; Issue published 09 March 2023
Abstract
This paper develops a new numerical framework for mode III crack problems of thin-walled structures by
integrating multiple advanced techniques in the boundary element literature. The details of special crack-tip
elements for displacement and stress are derived. An exponential transformation technique is introduced to
accurately calculate the nearly singular integral, which is the key task of the boundary element simulation of
thin-walled structures. Three numerical experiments with different types of cracks are provided to verify the
performance of the present numerical framework. Numerical results demonstrate that the present scheme is valid
for mode III crack problems of thin-walled structures with the thickness-to-length ratio in the microscale, even
nanoscale, regime.
Keywords
Cite This Article
APA Style
Ju, B., Qu, W., Gu, Y. (2023). Boundary element analysis for mode III crack problems of thin-walled structures from micro- to nano-scales. Computer Modeling in Engineering & Sciences, 136(3), 2677-2690. https://doi.org/10.32604/cmes.2023.025886
Vancouver Style
Ju B, Qu W, Gu Y. Boundary element analysis for mode III crack problems of thin-walled structures from micro- to nano-scales. Comput Model Eng Sci. 2023;136(3):2677-2690 https://doi.org/10.32604/cmes.2023.025886
IEEE Style
B. Ju, W. Qu, and Y. Gu "Boundary Element Analysis for Mode III Crack Problems of Thin-Walled Structures from Micro- to Nano-Scales," Comput. Model. Eng. Sci., vol. 136, no. 3, pp. 2677-2690. 2023. https://doi.org/10.32604/cmes.2023.025886