Open Access

ARTICLE

Computational Modeling of Intergranular Crack Propagation in an Intermetallic Compound Layer

Tong An^1,2,*, Rui Zhou^1,2, Fei Qin^1,2,*, Pei Chen^1,2, Yanwei Dai^1,2, Yanpeng Gong^1,2

1 Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
2 Beijing Key Laboratory of Advanced Manufacturing Technology, Beijing University of Technology, Beijing, 100124, China

* Corresponding Authors: Tong An. Email: ; Fei Qin. Email: