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A Novel RFID Localization Approach to Smart Self-Service Borrowing and Returning System

by Siguo Bi1, Cong Wang1, Jiajie Shen1, Wang Xiang1, Wei Ni2, Xin Wang1, Bochun Wu1,*, Yi Gong1,3,*

1 Fudan University, Shanghai, 200433, China
2 Commonwealth Scientific and Industrial Research Organization, Sydney, 2122, Australia
3 Zhengzhou University of Industrial Technology, Zhengzhou, 451100, China

* Corresponding Authors: Bochun Wu. Email: email; Yi Gong. Email: email

(This article belongs to the Special Issue: Models of Computation: Specification, Implementation and Challenges)

Computer Modeling in Engineering & Sciences 2023, 135(1), 527-538. https://doi.org/10.32604/cmes.2022.022298

Abstract

The misreading problem of a passive ultra-high-frequency (UHF) radio frequency identification (RFID) tag is a frequent problem arising in the field of librarianship. Unfortunately, existing solutions are something inefficient, e.g., extra resource requirement, inaccuracy, and empiricism. To this end, under comprehensive analysis on the passive UHF RFID application in the librarianship scenario, a novel and judicious approach based on RFID localization is proposed to address such a misreading problem. Extensive simulation results show that the proposed approach can outperform the existing ones and can be an attractive candidate in practice.

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Cite This Article

APA Style
Bi, S., Wang, C., Shen, J., Xiang, W., Ni, W. et al. (2023). A novel RFID localization approach to smart self-service borrowing and returning system. Computer Modeling in Engineering & Sciences, 135(1), 527-538. https://doi.org/10.32604/cmes.2022.022298
Vancouver Style
Bi S, Wang C, Shen J, Xiang W, Ni W, Wang X, et al. A novel RFID localization approach to smart self-service borrowing and returning system. Comput Model Eng Sci. 2023;135(1):527-538 https://doi.org/10.32604/cmes.2022.022298
IEEE Style
S. Bi et al., “A Novel RFID Localization Approach to Smart Self-Service Borrowing and Returning System,” Comput. Model. Eng. Sci., vol. 135, no. 1, pp. 527-538, 2023. https://doi.org/10.32604/cmes.2022.022298



cc Copyright © 2023 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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