Open Access

ARTICLE

A Novel Meshfree Analysis of Transient Heat Conduction Problems Using RRKPM

Hongfen Gao¹, Gaofeng Wei^2,3,*

1 College of Intelligent Engineering, Shandong Management University, Jinan, 250357, China
2 School of Mechanical and Automotive Engineering, Qilu University of Technology (Shandong Academy of Sciences), Jinan, 250353, China
3 Shandong Institute of Mechanical Design and Research, Jinan, 250353, China

* Corresponding Author: Gaofeng Wei. Email: