Open Access

ARTICLE

Numerical and Experimental Investigations of the Thermal Fatigue Lifetime of CBGA Packages

Borui Yang¹, Jun Luo², Bo Wan^1,*, Yutai Su^1,3, Guicui Fu¹, Xu Long^3,*

1 School of Reliability and Systems Engineering, Beihang University, Beijing, 100191, China
2 Sichuan Institute of Solid-State Circuits, China Electronics Technology Group Corporation, Chongqing, 400060, China
3 School of Mechanics, Civil Engineering and Architecture, Northwestern Polytechnical University, Xi’an, 710072, China

* Corresponding Authors: Bo Wan. Email: ; Xu Long. Email:

(This article belongs to this Special Issue: Mechanical Reliability of Advanced Materials and Structures for Harsh Applications)

Computer Modeling in Engineering & Sciences 2022, 130(2), 1113-1134. https://doi.org/10.32604/cmes.2022.018037

Received 24 June 2021; Accepted 04 August 2021; Issue published 13 December 2021

Abstract

A thermal fatigue lifetime prediction model of ceramic ball grid array (CBGA) packages is proposed based on the Darveaux model. A finite element model of the CBGA packages is established, and the Anand model is used to describe the viscoplasticity of the CBGA solder. The average viscoplastic strain energy density increment ΔWave of the CBGA packages is obtained using a finite element simulation, and the influence of different structural parameters on the ΔWave is analyzed. A simplified analytical model of the ΔWave is established using the simulation data. The thermal fatigue lifetime of CBGA packages is obtained from a thermal cycling test. The Darveaux lifetime prediction model is modified based on the thermal fatigue lifetime obtained from the experiment and the corresponding ΔWave. A validation test is conducted to verify the accuracy of the thermal fatigue lifetime prediction model of the CBGA packages. This proposed model can be used in engineering to evaluate the lifetime of CBGA packages.

---

Keywords

---