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Numerical Simulation of Multi-Layer Penetration Process of Binder Droplet in 3DP Technique

Xiangyu Gao, Weidong Yang*, Hongxuan Xian, Xiyuan Tu, Yuanyuang Wang*

School of Mechanical Engineering, Hebei University of Technology, Tianjin, 300130, China

* Corresponding Authors: Weidong Yang. Email: email; Yuanyuan Wang. Email: email

TSP_CMES_9923.pdf

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