Open Access

ARTICLE

Stress Analysis of Printed Circuit Board with Different Thickness and Composite Materials Under Shock Loading

Kuan-Ting Liu¹, Chun-Lin Lu¹, Nyan-Hwa Tai², Meng-Kao Yeh^{1, *}

1 Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, 30013, Taiwan.
2 Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, 30013, Taiwan.

* Corresponding Author: Meng-Kao Yeh. Email: .