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A Simple FEM for Solving Two-Dimensional Diffusion Equation with Nonlinear Interface Jump Conditions

by Liqun Wang, Songming Hou, Liwei Shi

1 China University of Petroleum-Beijing, Deptartment of Mathematics, College of Science, Beijing, 102249, China.
2 Louisiana Tech University, Deptartment of Mathematics and Statistics, LA, Rustion, 71272, USA.
3 China University of Political Science and Law, Deptartment of Science and Technology, Beijing, 102249, China.

* Corresponding Author: Liwei Shi. Email: email.

(This article belongs to the Special Issue: Recent Developments of Immersed Methods for Fluid-structure Interactions)

Computer Modeling in Engineering & Sciences 2019, 119(1), 73-90. https://doi.org/10.32604/cmes.2019.04581

Abstract

In this paper, we propose a numerical method for solving parabolic interface problems with nonhomogeneous flux jump condition and nonlinear jump condition. The main idea is to use traditional finite element method on semi-Cartesian mesh coupled with Newton’s method to handle nonlinearity. It is easy to implement even though variable coefficients are used in the jump condition instead of constant in previous work for elliptic interface problem. Numerical experiments show that our method is about second order accurate in the L norm.

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Cite This Article

APA Style
Wang, L., Hou, S., Shi, L. (2019). A simple FEM for solving two-dimensional diffusion equation with nonlinear interface jump conditions. Computer Modeling in Engineering & Sciences, 119(1), 73-90. https://doi.org/10.32604/cmes.2019.04581
Vancouver Style
Wang L, Hou S, Shi L. A simple FEM for solving two-dimensional diffusion equation with nonlinear interface jump conditions. Comput Model Eng Sci. 2019;119(1):73-90 https://doi.org/10.32604/cmes.2019.04581
IEEE Style
L. Wang, S. Hou, and L. Shi, “A Simple FEM for Solving Two-Dimensional Diffusion Equation with Nonlinear Interface Jump Conditions,” Comput. Model. Eng. Sci., vol. 119, no. 1, pp. 73-90, 2019. https://doi.org/10.32604/cmes.2019.04581



cc Copyright © 2019 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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