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A Virtual Crack Closure-Integral Method (VCCM) for Three-Dimensional Crack Problems Using Linear Tetrahedral Finite Elements

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1 Kagoshima University, Japan

Computer Modeling in Engineering & Sciences 2005, 10(3), 229-238. https://doi.org/10.3970/cmes.2005.010.229

Abstract

In this paper, a three-dimensional VCCM (Virtual Crack Closure-Integral Method) for evaluating the energy release rate and the stress intensity factor is presented. Many engineers and researchers believe that hexahedral finite elements should be used to perform three-dimensional fracture analyses. Previous VCCM formulations assume the use of hexahedral finite elements. In present study, the authors have been developing a VCCM that works with tetrahedral finite elements. In the field of large-scale computation, the use of tetrahedral finite elements has becoming very popular as high performance mesh generation programs became available. Therefore, building a large and complex analysis model with hexahedral finite elements is a much more difficult task than with tetrahedral elements. The outcomes of present research would make three-dimensional fracture mechanics analysis on complex shaped solid/structure a tractable task to do. In this paper, some preliminary results are presented.

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APA Style
Okada, H., Kamibeppu, T. (2005). A virtual crack closure-integral method (VCCM) for three-dimensional crack problems using linear tetrahedral finite elements. Computer Modeling in Engineering & Sciences, 10(3), 229-238. https://doi.org/10.3970/cmes.2005.010.229
Vancouver Style
Okada H, Kamibeppu T. A virtual crack closure-integral method (VCCM) for three-dimensional crack problems using linear tetrahedral finite elements. Comput Model Eng Sci. 2005;10(3):229-238 https://doi.org/10.3970/cmes.2005.010.229
IEEE Style
H. Okada and T. Kamibeppu, “A Virtual Crack Closure-Integral Method (VCCM) for Three-Dimensional Crack Problems Using Linear Tetrahedral Finite Elements,” Comput. Model. Eng. Sci., vol. 10, no. 3, pp. 229-238, 2005. https://doi.org/10.3970/cmes.2005.010.229



cc Copyright © 2005 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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