Table of Content

Open Access iconOpen Access

ARTICLE

An Aspect of Hall-Petch Effect in Metallograin Structure

by Michihiko Nakagaki1, Shuji Takashima2, Ryosuke Matsumoto1, Noriyuki Miyazaki2

Kyushu Institute of Technology, Fukuoka, Japan
Kyoto University, Kyoto, Japan

Computer Modeling in Engineering & Sciences 2005, 10(3), 199-208. https://doi.org/10.3970/cmes.2005.010.199

Abstract

The present paper focuses on the micromechanical phenomena occurring in the polycrystalline metal materials. Correlations between the material hardening and the plastic lattice dislocation were discussed with the presence of the grain boundary. The characteristic distribution of the plastic strain gradient is numerically recognized, and hence the validity of incorporating the strain gradient term in the constitutive law is demonstrated. Also, the modeling of the inclusion interface sliding and debonding was performed on the equivalent inclusion theory to develop the constitutive law for the composite. The sliding model is considered to be effective to model the superplastic behavior of highly ductile metals. The superplastic phenomenon was recognized in the numerical test with the use of the presently suggested particle dispersed model, and its mechanism was attempted to be explained.

Keywords


Cite This Article

APA Style
Nakagaki, M., Takashima, S., Matsumoto, R., Miyazaki, N. (2005). An aspect of hall-petch effect in metallograin structure. Computer Modeling in Engineering & Sciences, 10(3), 199-208. https://doi.org/10.3970/cmes.2005.010.199
Vancouver Style
Nakagaki M, Takashima S, Matsumoto R, Miyazaki N. An aspect of hall-petch effect in metallograin structure. Comput Model Eng Sci. 2005;10(3):199-208 https://doi.org/10.3970/cmes.2005.010.199
IEEE Style
M. Nakagaki, S. Takashima, R. Matsumoto, and N. Miyazaki, “An Aspect of Hall-Petch Effect in Metallograin Structure,” Comput. Model. Eng. Sci., vol. 10, no. 3, pp. 199-208, 2005. https://doi.org/10.3970/cmes.2005.010.199



cc Copyright © 2005 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
  • 1494

    View

  • 1188

    Download

  • 0

    Like

Related articles

Share Link