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Issues in Modeling Heterogeneous Deformations in Polycrystalline Metals using Multiscale Approaches

by Paul R. Dawson1, Donald E. Boyce2, Ronald Rogge3

Sibley School of Mechanical and Aerospace Engineering, Cornell University, Ithaca, NY, USA 14853
Sibley School of Mechanical and Aerospace Engineering, Cornell University, Ithaca, NY, USA 14853
Neutron Program for Materials Research, National Research Council of Canada, Chalk River, Ontario, Canada

Computer Modeling in Engineering & Sciences 2005, 10(2), 123-142. https://doi.org/10.3970/cmes.2005.010.123

Abstract

Computational mechanics provides a powerful environment for modeling the evolution of material structure during deformation processes and for associating that evolution with changes to the mechanical properties. In this paper, we illustrate a two-scale formulation that links the mechanical loading applied at the scale of a component (the continuum scale) to the responses of the material at the scale of the crystals that comprise it (the crystal scale). Employing the capabilities offered by computational mechanics, we can better understand how heterogeneity of deformation arising at both the continuum and crystal scales influences the behaviors observed experimentally. Such an understanding is central to improving the performance of engineering alloys.

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APA Style
Dawson, P.R., Boyce, D.E., Rogge, R. (2005). Issues in modeling heterogeneous deformations in polycrystalline metals using multiscale approaches. Computer Modeling in Engineering & Sciences, 10(2), 123-142. https://doi.org/10.3970/cmes.2005.010.123
Vancouver Style
Dawson PR, Boyce DE, Rogge R. Issues in modeling heterogeneous deformations in polycrystalline metals using multiscale approaches. Comput Model Eng Sci. 2005;10(2):123-142 https://doi.org/10.3970/cmes.2005.010.123
IEEE Style
P. R. Dawson, D. E. Boyce, and R. Rogge, “Issues in Modeling Heterogeneous Deformations in Polycrystalline Metals using Multiscale Approaches,” Comput. Model. Eng. Sci., vol. 10, no. 2, pp. 123-142, 2005. https://doi.org/10.3970/cmes.2005.010.123



cc Copyright © 2005 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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