Open Access

ARTICLE

First-principles Calculation of Interfacial Adhesion Strength and Electromigration for the Micro-bump Interconnect of 3D Chip Stacking Packaging

W.H. Chen¹, H.C. Cheng^2,3, C.F. Yu^1,3

1 Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan, ROC.
2 Department of Aerospace and Systems Engineering Feng Chia University, Taichung, Taiwan, ROC.
3 Corresponding author.