CMES-Vol. 109-110, No. 1, 2015

Open Access

ARTICLE

First-principles Calculation of Interfacial Adhesion Strength and Electromigration for the Micro-bump Interconnect of 3D Chip Stacking Packaging
W.H. Chen¹, H.C. Cheng^2,3, C.F. Yu^1,3
CMES-Computer Modeling in Engineering & Sciences, Vol.109-110, No.1, pp. 1-13, 2015, DOI:10.3970/cmes.2015.109.001
Abstract This study aims at exploring the interfacial adhesion strength between solder bump and four typical under bump metallurgies (UBMs), i.e., Cu/Ni, Cu/TiW, Cu/Ni/Cr and /Cu/V/Cr, at atomistic scale. The average bond length and interfacial adhesion stress of the Sn-3.5Ag/Cu/Ni, Sn-3.5Ag/Cu/TiW, Sn-3.5Ag/Cu/Ni/Cr and Sn-3.5Ag/Cu/V/Cr micro-bump interconnects are calculated through the firstprinciples density functional theory (DFT) calculation to estimate the interfacial adhesion strength between the solder bump and UBMs. In addition, by investigating the electric field effect on the average bond length and adhesive stress, the combination of solder bump and UBM with better interfacial adhesion strength… More >

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ARTICLE

Boundary Element Analysis of Thin Anisotropic Structures by a Self-regularization Scheme
Y.C. Shiah¹, C.L. Tan^2,3, Li-Ding Chan¹
CMES-Computer Modeling in Engineering & Sciences, Vol.109-110, No.1, pp. 15-33, 2015, DOI:10.3970/cmes.2015.109.015
Abstract In the conventional boundary element method (BEM), the presence of singular kernels in the boundary integral equation or integral identities causes serious inaccuracy of the numerical solutions when the source and field points are very close to each other. This situation occurs commonly in elastostatic analysis of thin structures. The numerical inaccuracy issue can be resolved by some regularization process. Very recently, the self-regularization scheme originally proposed by Cruse and Richardson (1996) for 2D stress analysis has been extended and modified by He and Tan (2013) to 3D elastostatics analysis of isotropic bodies. This paper More >

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ARTICLE

Meshfree Method for the Topological Design of Microstructural Composites
Y. Wang¹, E. Lü^1,2, J. Zhao¹, J. Guo¹
CMES-Computer Modeling in Engineering & Sciences, Vol.109-110, No.1, pp. 35-53, 2015, DOI:10.3970/cmes.2015.109.035
Abstract Meshfree methods have found good applications in many new researches, which show very good potential to be powerful numerical tools. As an alternative to the mesh based methods, meshfree methods have the advantage of not using a predefined mesh for the domain discretization. In this study, a mesh free scheme based on the radial point interpolation method was used to solve the topological design of microstructures for composite materials. The explicit form of the radial point interpolation method (RPIM) interpolation augmented with polynomials is presented, which satisfies range-restricted properties and is applicable to integrate a More >

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ARTICLE

Analysis of Square-shaped Crack in Layered Halfspace Subject to Uniform Loading over Rectangular Surface Area
H. T. Xiao^1,2,3, Y. Y. Xie^1,2, Z. Q. Yue⁴
CMES-Computer Modeling in Engineering & Sciences, Vol.109-110, No.1, pp. 55-80, 2015, DOI:10.3970/cmes.2015.109.055
Abstract This paper examines the problem of a square-shaped crack embedded in a layered half-space whose external surface is subject to a uniform loading over a rectangular area. Two novel numerical methods and the superposition principle in fracture mechanics are employed for the analysis of the crack problem. The numerical methods are based on the fundamental solution of a multilayered elastic medium and are, respectively, applied to calculate the stress fields of layered halfspace without cracks and the discontinuous displacements of crack surfaces in layered halfspace. The stress intensity factor (SIF) values are calculated using discontinuous More >

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