Open Access

ARTICLE

A Micromechanical Model for Estimating the Effective Stiffness of a Pair of Micro-cracked Interfaces in an Orthotropic Trimaterial under Inplane Deformations

by X. Wang¹, W.T. Ang¹, H. Fan¹

1 School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore
2 Author for correspondence, http://www.ntu.edu.sg/home/mwtang/, Email: mwtang@ntu.edu.sg

Computer Modeling in Engineering & Sciences 2015, 107(2), 81-101. https://doi.org/10.3970/cmes.2015.107.081

Abstract

A micromechanical model is proposed here for estimating the effective stiffness of a pair of parallel microscopically damaged interfaces in a trimaterial under inplane elastostatic deformations. The trimaterial is made of an orthotropic thin layer sandwiched between two orthotropic half-spaces. The microscopically damaged interfaces are modeled using periodically distributed interfacial micro-cracks. The micromechanical model is formulated and numerically solved in terms of hypersingular boundary integro-differential equations. The effects of the width of the thin layer, the micro-crack densities of the two interfaces and the material constants of the thin layer and the two half-spaces on the effective stiffness coefficients are investigated.

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