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Collocation Methods to Solve Certain Hilbert Integral Equation with Middle Rectangle Rule

Jin Li1,2, De-hao Yu3,4

School of Sciences, Shandong Jianzhu University, Jinan 250101, China.
School of Mathematics, Shandong University, Jinan 250100, P. R.China.
School of Mathematical Sciences, Xiamen University, Xiamen 361005, China.
LSEC, ICMSEC, Academy of Mathematics and System Science, Chinese Academy of Sciences, Beijing 100190, China.

Computer Modeling in Engineering & Sciences 2014, 102(2), 103-126. https://doi.org/10.3970/cmes.2014.102.103

Abstract

The generalized composite middle rectangle rule for the computation of Hilbert integral is discussed. The pointwise superconvergence phenomenon is presented, i.e., when the singular point coincides with some a priori known point, the convergence rate of the rectangle rule is higher than what is global possible. We proved that the superconvergence rate of the composite middle rectangle rule occurs at certain local coordinate of each subinterval and the corresponding superconvergence error estimate is obtained. By choosing the superconvergence point as the collocation points, a collocation scheme for solving the relevant Hilbert integral equation is presented and an error estimate is established. At last, some numerical examples are provided to validate the theoretical analysis.

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Cite This Article

APA Style
Li, J., Yu, D. (2014). Collocation methods to solve certain hilbert integral equation with middle rectangle rule. Computer Modeling in Engineering & Sciences, 102(2), 103-126. https://doi.org/10.3970/cmes.2014.102.103
Vancouver Style
Li J, Yu D. Collocation methods to solve certain hilbert integral equation with middle rectangle rule. Comput Model Eng Sci. 2014;102(2):103-126 https://doi.org/10.3970/cmes.2014.102.103
IEEE Style
J. Li and D. Yu, “Collocation Methods to Solve Certain Hilbert Integral Equation with Middle Rectangle Rule,” Comput. Model. Eng. Sci., vol. 102, no. 2, pp. 103-126, 2014. https://doi.org/10.3970/cmes.2014.102.103



cc Copyright © 2014 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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