Special Issue "Thermofluid Topology Optimization"

Submission Deadline: 31 March 2022
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Guest Editors
Prof. Baotong Li, Xi'an Jiaotong University, China
Prof. Shinji Nishiwaki, Kyoto University, Japan


    With the rapid development of advanced equipment, thermal management has become one of the main challenges that restricts equipment performance. Thermofluid cooling devices are one key to overcome such challenge. More importantly, taking advantage of the topology optimization to design thermal-fluid coupled equipment makes a new way to improve thermal management of complex system under harsh working condition. However, the computation cost of the numerical analysis in thermofluid system is expensive, and the corresponding research on topology optimization is still not enough. Therefore, engineers tend to develop new thermal management devices by modifying previous efficient structures, and the innovation of thermofluid structures is still difficult.

    The difficulties in the topology optimization of thermofluid devices involve three questions:

    1. how to establish rapid and accurate analysis method for thermofluid problem?

    2. how to establish matching optimization method for thermofluid structures?

    3. how to apply topology optimization in engineering?


    In fact, calculation accuracy and computation cost are a pair of contradictions in the classic thermofluid analysis. The time consuming analysis makes the topology optimization infeasible. Besides, the thermofluid analysis involving different scales and fluids also require research in simplification of the fluid model, rapid analysis tools for various types of fluids, and in-depth discussion on the fluid analysis methods’ applicable scenarios.

    In addition, the study on thermofluid topology optimization is not a simple combination of the classic topology optimization method and the thermofluid analysis tool. Researchers need to develop appropriate description scheme for the topology of fluid, modify the generation mode of the fluid structures’ topology, and improve the computational efficiency of the optimization algorithms.

    Besides, constraints including manufacturability, measurability and cost should be considered in engineering application. Thermofluid topology optimization oriented to engineering can help to inspire the research of peers. This special issue also encourages research oriented to engineering requirements.


    Research topics include but are not limited to the following:

  • Novel structural design method oriented to thermofluid problems

  • Novel analysis theory for thermofluid structures

  • Discussion on numerical analysis method for thermofluid field oriented to different working conditions

  • Description method for the topology of various fluid

  • Simplification and modification of navier stokes equation for rapid solution

  • Topology optimization of thermofluid structures at various scales and in various types of engineering systems;

  • Computing method for thermofluid analysis

  • Topology optimization of multiphase thermal-fluid coupled field

  • Mathematical methods for thermal-fluid coupled field

  • Numerical analysis for thermal-fluid coupled field considering scale effect

  • Thermofluid topology optimization in engineering

  • Topology optimization of air cooling structure

  • Topology optimization of liquid cooling structure

  • Efficient computing method in high performance computer

Thermofluid topology optimization; Thermofluid analysis; Simplification of navier stokes equation; Topology description method; Air cooling; Liquid cooling; Efficient computing method