Vol.16, No.2, 2020, pp.199-209, doi:10.32604/fdmp.2020.07986
Fluid Flow and Convective Heat Transfer in a Water Chemical Condenser
  • Mounir Kriraa1,2,*, Khalid Souhar3, Driss Achemlal4, Youssef Ait Yassine5,6, Abdelmajid Farchi1
1 IMII Ingénierie, Management et Innovation Industriell, FST, Hassan 1er University, Settat, Morocco
2 LMPEQ, National School of Applied Sciences, Safi, Cadi Ayyad University, Marrakech, Morocco
3 LGEMS Laboratory, National School of Applied Sciences, Ibn Zohr University, Agadir, 80000, Morocco
4 Engineering Sciences Laboratory, Department of Mathematics, Physics and Informatics, Polydisciplinary Faculty of Taza, Sidi Mohamed Ben Abdellah University, Fez, Morocco
5 Ibn Zohr University, Higher School of Technology, Laâyoune, Morocco
6 Ibn Zohr University, Faculty of Science, Laboratory of Thermodynamics and Energy, Agadir, Morocco
* Corresponding Author: Mounir Kriraa. Email: kriraa.m@gmail.com
Received 17 July 2019; Accepted 18 November 2019; Issue published 21 April 2020
In this paper, a detailed investigation of water (Pr ¼ 7:0) convection in a chemical condenser is carried out. Two openings are located along one side of the cavity. The Navier-Stokes equations are solved in the frame of a control volume method using the SIMPLEC algorithm to implement adequate coupling of pressure and velocity. Special emphasis is given to the influence of the Reynolds number, the tilt of the channel and the Rayleigh number on the convective heat transfer. Results are presented and discussed allowing the control parameters to span relatively wide intervals: Rayleigh number (104 ≤ Ra ≤ 5 × 105), channel inclination (0° ≤ φ ≤ 90°) and Reynolds number (10 ≤ Re ≤ 1000). On the basis of these results, a new correlation of the Nusselt number is elaborated.
Chemical condenser; tilted channel; convection; numerical study; heat transfer
Cite This Article
Kriraa, M., Souhar, K., Achemlal, D., Yassine, Y. A., Farchi, A. (2020). Fluid Flow and Convective Heat Transfer in a Water Chemical Condenser. FDMP-Fluid Dynamics & Materials Processing, 16(2), 199–209.